RELIFE 150G SOLDER PASTE

RELIFE 150G SOLDER PASTE Advanced quality Relife soldering paste, Easy for welding. Gives Good insulation, a smooth welding surface, and Good immensity, No deterioration no dryness. The flux is very effective. IC and PCB for no corrosive.Only slightly higher than the boiling point of the melting point of the solder. The Shape is similar to the butter-like paste. High bond strength, PH value neutral, insulation resistance, welding surface smooth. For mobile phones, PC cards, and other sophisticated electronic chip-level flux welding.

Product Description

• Weight and Packaging:

  • The “RELIFE 150G SOLDER PASTE” likely indicates the weight of the solder paste, which is 150 grams. Packaging can vary, and it might come in a syringe, jar, or other container.

• Flux Type:

  • RELIFE 150G SOLDER PASTE often contains flux to help with the soldering process. Flux is crucial for cleaning and promoting the wetting of the solder to the surfaces being joined.

• Lead-Free or Leaded:

  • Depending on the specific product, the solder paste might be lead-free or contain lead. Lead-free solder is commonly used due to environmental considerations.

• Application Method:

  • Solder paste is usually applied using a stencil, dispensing equipment, or a syringe, depending on the specific requirements of the soldering process.

• Melting Point:

  • Solder paste melts at a specific temperature during the reflow soldering process. The melting point depends on the composition of the solder alloy.

• Storage and Shelf Life:

  • Proper storage conditions, such as avoiding excessive heat or moisture, are essential for maintaining the quality of solder paste. Check the product information for its recommended shelf life.

उन्नत गुणवत्ता सोल्डरिंग पेस्ट, वेल्डिंग के लिए आसान। अच्छा इन्सुलेशन देता है, एक चिकनी वेल्डिंग सतह, और अच्छी विशालता, कोई गिरावट नहीं कोई सूखापन नहीं। प्रवाह बहुत प्रभावी है। बिना संक्षारक के आईसी और पीसीबी। मिलाप के गलनांक के क्वथनांक से थोड़ा अधिक। आकार मक्खन की तरह पेस्ट के समान है। उच्च बंधन शक्ति, पीएच मान तटस्थ, इन्सुलेशन प्रतिरोध, वेल्डिंग सतह चिकनी। मोबाइल फोन, पीसी कार्ड और अन्य परिष्कृत इलेक्ट्रॉनिक चिप-स्तरीय फ्लक्स वेल्डिंग के लिए।

NOTE : GSMSMARTPRICE is gathering the best information from various websites live prices may defer from the listed price

• Joint high intensity
• Good immersion
• Neutral PH7 + 0.3
• No poison no orrosion
• Good insulation
• Smooth welding surface
• No deterioration no dry

RELIFE 150G SOLDER PASTE